Status : Verified
Personal Name Quimada, Nathaniel E.
Resource Title Treatment of printed circuit board wasterwater containing copper and nickel ions through fluidized-bed homogeneous granulation process
Date Issued 17 December 2019
Abstract With the rapid advancement of evolution of world’s informatics technology, the
creation of electric and electronic equipment (EEE) is drastically increasing. Printed
Circuit Boards (PCBs) are essential components in almost all EEE. However, the
production of the PCBs produces wastewaters containing elevated concentrations of copper
and nickel ions. If these metals ions are considered as major pollutants that affects human
health and our environment.
In this study, a system was proposed for the removal of copper and nickel ions from
a synthetic wastewater by fluidized-bed homogeneous granulation process (FBHGP). The
use of fluidized-bed reactor (FBR) evaluated the effects of different parameters, including
initial operating pH, total carbonate loading and precipitant flow rate. The granules
produced after the treatment were collected, dried, sieved and analyzed for the evaluation
of their physical and chemical characteristics through SEM, XRD and EDX analyses. The
optimum operating conditions was found to be at initial pH of 6.5, total carbonate loading
of 17 mM, precipitant flow rate of 15 mL/min; with the highest copper removal of 98%
and copper granulation of 94%, nickel removal and nickel granulation of 80% and 72%,
respectively. The granules collected at the optimum condition were >0.42 mm diameter
size and found to have presence of Cu2+
, Ni2+ and O.
Degree Course MS Environmental Engineering
Language English
Keyword wastewater, treatment, fluidized-bed homogeneous, granulation
Material Type Thesis/Dissertation
Preliminary Pages
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