Status : Verified
Personal Name Clemente, Laura May Antoinette D.
Resource Title The future of advanced semiconductor packaging in the Philippines - a technology foresight through scenario building
Date Issued 30 May 2025
Abstract The semiconductor industry continues to drive technological advancements, enabling the development of artificial intelligence (AI), the Internet of Things (IoT), and advanced computing systems. With transistor scaling reaching physical limitations, advanced semiconductor packaging has become a critical area of innovation. This study explored the potential for the Philippines to establish itself as a key player in advanced packaging by leveraging existing strengths in semiconductor assembly and packaging capabilities.

A technology foresight through scenario building was used to assess key industry focal areas, uncertainties, and strategic drivers. Three scenarios were developed: (1) Academe, industry, and government collaboration to enhance research and workforce development, (2) Establishing a Packaging Center of Excellence to drive innovation and capability building, and (3) localizing the semiconductor value chain to enhance supply chain resilience and economic competitiveness. The results of the study showed the need for targeted policy support, investment in R&D infrastructure, and workforce skills alignment to industry needs. The insights from this study could serve as a foundation for strategic planning and policy formulation to position the Philippines as a competitive hub for advanced semiconductor packaging in Southeast Asia.
Degree Course Master of Technology Management
Language English
Keyword Technology foresight; Scenario building; Advanced semiconductor packaging
Material Type Thesis/Dissertation
Preliminary Pages
82.61 Kb
Category : F - Regular work, i.e., it has no patentable invention or creation, the author does not wish for personal publication, there is no confidential information.
 
Access Permission : Open Access